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is a special high-speed memory that redueces the time the CPU takes to access data.
using SRAM (static RAM)
Cache is divided into levels: L1,L2,L3
- level 1 Cache (L1):
- -is the first one accessed by the CPU
- -Fastest cache to be found
- -lowest latency
- -resides within the CPU core
- Level 2 cache (L2):
- accessed after L1
- Level 3 cache (L3):
- -Most latency
- -Largest Cache
Also know as HT Teachnology
-Enables a single CPU to accept and calculate two independent sets of instructions at the same time.
-Only one CPU is present
-is the process of running on or more operating systems on the same computer.
GPU Integrated Graphics
-Graphics components in the CPU die
-More than one physical processor core on one die
Thermal Design power(TDP)
- -it maximum power that the computer's cooling system needs to dissipate heat generated by the CPU
- -is rated in watts
-is a block of metal made to sit right on top of the CPU, to help dissipates the heat of the CPU
Also known as Thermal paste, Thermal interface material
-Fill the tiny gaps and imperfections between the CPU and Heat Sink
-Must reapply thermal compound whenever removing and re-installing a heat sink
-refers to how many instructions the CPU can perform at a time.
-Speed is determined by a system clock, created from a quartz oscillating crystal soldered directly to the motherboard.
Known as x86
-is limited to 4GB of RAM
- -it can run 32-bit software
- -can address a default maximum of 265 trabytes of RAM
PGA Pin Grid Array
-pin on the CPU are places in the pinholes of he socket, and locked into place by a retaining arm
-use mosty by AMD
LGA Land Grid Array
known as Socket T
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