MIL-STD-1310H.txt

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Author:
bc901
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286892
Filename:
MIL-STD-1310H.txt
Updated:
2014-10-24 01:20:57
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  1. What class of bond?
  2. Metallic surfaces bonded by welding or brazing.
    Class A
  3. What class of bond?
  4. Metallic surfaces (bright metal) bonded by bolting or clamping
    Class B
  5. What class of bond?
  6. Metallic surfaces (bright metal) bonded by bridging them with a metallic (conductive) bond strap.
    Class C
  7. Type of Bond Strap?
  8. CRES 316 1/4 inch wire rope with lugs of CRES 316L SCHED 80S pipe
    Type 1
  9. Type of bond strap?
  10. Flat CRES 316 (1x5 width to length ratio) with mounting holes in each end.
    Type II
  11. Type of bond strap?
  12. Flat copper (1x5 width to length ratio) with mounting holes in each end.
    Type III
  13. Type of bond strap?
  14. Flat copper braid (minimum 1" width) with end terminals and mounting holes in each end.
    Type IV.
  15. Type of bond strap?
  16. A modified MIL-DTL-24749 Type of uniquely constructed bond strap for unique and specific application.
    Type V
  17. Bonding of electrical and electronic equipment cabinets, cases, housings and exposed metal (conductive) components to ground potential by any class bond described herein, or by the installation of a ground wire to establish a contact resistance of _____ ohm or less.
    0.1
  18. EM interference that has the spectral energy distributed over a wide frequency in relation to the frequency bandwidth of the equipment receiving the interference.
    Broadband noise
  19. A contact area between two metallic surfaces which exhibits nonlinear voltage-current transfer characteristics when subjected to an RF voltage.
    Nonlinear junction
  20. Class __ bonding will be used to maintain the ship’s ground plane.
    A
  21. Class __ and __ bonding shall be used only as required for electrical safety, equipment operation, EMI mitigation, or EMP effects control.
    B, C
  22. Bolts in Class C bonding straps should be torque bolted to ___ foot-pounds.
    25
  23. Type ___ bond straps shall be used in shipboard topside areas when appropriate for electrical safety equipment operation, EMP effects control and to bond metal-to-metal junctions identified as hull-generated EMI (BBN/IMI) sources.
    I
  24. Type ___ bond straps shall be used in shipboard topside areas for bonding EMI source items such as antenna tuners or couplers , equipments, enclosures, and cabinets.
    II
  25. Type ___ bond straps shall be used in shipboard below deck areas for bonding equipments, enclosures, and cabinets.
    III
  26. Type ___ bond straps shall be used in shipboard below deck areas for bonding equipment utilizing sound isolated mounts or shock mounts (nonmetallic mounts).
    IV
  27. Type __ bond straps shall be designed as required for unusual situations when a standard bond strap constructed in accordance with MIL-DTL-24749 is not practical.
    V
  28. The electrical bonding resistance of hull penetrations to ground potential for EMI control shall be ___ milliohms or less, including the cumulative effect of all faying surface interfaces, and obtained by the using the following methods.
    15
  29. A Type I bond strap will provide less than ___ ohms impedance at 30 MHz.
    25
  30. Number _____ AWG cables shall be used as main ground cables for grounding all electrical and electronic equipment and metallic items
    0000

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